High Performance IC
IC substrates are used to produce the integrated circuits that power cutting-edge technologies such as 5G, artificial intelligence (AI), and augmented reality (AR). These complex applications have increased the demand for high-performance IC substrates that can handle the performance and complexity requirements.
Achieving these goals requires implementing advanced process tools, stringent inspection and metrology procedures, and a robust control environment. The most challenging aspect of achieving these goals is minimizing defects, which is crucial to maintaining a high yield rate. Using the latest technology, KLA has developed the most advanced IC substrate inspection system on the market, enabling manufacturers to reduce defects and achieve higher yield rates.
The ic substrate industry is undergoing significant transformations driven by technological advancements and changing consumer preferences. These trends include rising demand for organic IC substrates, the emergence of Fan-Out Wafer-Level Packaging (FOWLP), and greater emphasis on sustainability. The future of IC substrates will be shaped by the development of increasingly powerful, compact, and efficient integrated circuits.
High Performance IC Substrates
ICs are the foundation of modern electronic devices such as cell phones, computers, tablets, and medical equipment. They have made significant contributions to the world economy and are expected to continue to drive innovation in a variety of fields. However, their growth is presenting new challenges. The increasing complexity of ICs requires new manufacturing processes and materials. As a result, there is a growing need for high-performance IC substrates that offer superior reliability and quality.
An IC substrate is a rigid printed circuit board that supports a single or multiple chips. The substrate is designed to protect, reinforce, and support the chip while providing a thermal dissipation tunnel. There are several different types of IC substrates, including BGA, FCBGA, and CSP. IC substrates are categorized based on their package type, bonding technology, and m1aterial attributes.
Rigid IC substrates are made of polymer laminate-type materials, such as bismaleimide-triazine (BT), resin reinforced with fiberglass, and Ajinomoto Build-Up Film (ABF). They are also called molded interconnect substrates or MIS. They are most commonly used for advanced packages like FCBGA and FBGA. These advanced IC substrates have good electrical performances, low signal interference, and effective thermal dissipation.
IC substrates are produced by the world’s top semiconductor foundries, which are mostly located in Asia Pacific. Countries such as Taiwan, South Korea, and China are home to cutting-edge manufacturing facilities with skilled labor. This proximity provides cost advantages for manufacturers, as well as shorter shipping distances. However, the region’s dependence on a few essential suppliers for critical materials can cause shortages if there are any production or shipment issues. This makes it important to source a reliable, global IC substrate supplier.
